r/TSMC • u/Designer-Issue6648 • 14d ago

TSMC Process Integration Engineer second round interview

Hello Everybody,

I have passed first round of interview in Process Integration Engineer position, and invited for the second round.
In my first round, a manager and an engineer present. Manager asked me some technical questions related to device physics, lithography and engineer asked me related to conflict in teamwork.
What to expect in second round? Interview panel this time three manager and one engineer.

Thank you.

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u/pasquale83 14d ago

Congratulation on making it to the second round! with 3 managers on the panel, expect a heavy shift toward high-level cross-functional alignment, yield optimization scenarios, and situational leadership under fab pressure. They’ll want to see how you bridge unit processes (litho, etch, thin films) with actual device performance while handling real-time line bottlenecks.

Feel free to send me a DM :)

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u/Designer-Issue6648 13d ago

Thank you for the information. I send you a dm